Improvements
The improvements I would like to make would be to change the electronics through hole components to surface mount components (SMD). I would include the mounting for the ultrasonic sensors rather than pre-drilling them on the board like I did on the first revision PCB. I would move the 4 x AA battery pack from the front of the board to the back of the board. By doing this, it would add a bit more weight to the
back of the board and traction to the wheels, therefore avoiding wheel slips. I would also like to research on other sensing technologies out there so I can integrate that also on the PCB.
back of the board and traction to the wheels, therefore avoiding wheel slips. I would also like to research on other sensing technologies out there so I can integrate that also on the PCB.